Ceramic Bga Reliability

Substrate based ball grid array bga flip chip bga quad flat leadless stacked chip scale flip chip csp xuejun fan moisture related reliability xuejun fan lamar edu higher performance smaller size cheaper price chip scale and wafer level packaging csp wlp.

Ceramic bga reliability.

Bga package component reliability after long term storage r. Typically these are packaged in organic or ceramic ball grid array bga packages which cover a wide range of package input output i o capabilities required for high performance devices. Flip chip cbga is a common package for high end microprocessor devices. A small tape based plastic bga package with 280 balls was included in the study 16 x 16 mm 0 8 mm pitch 9 x 9 depopulated center.

Ceramic ball grid array package drawings bg accept and proceed. Shih et al reliability of hitce ceramic bga packages to be published 2005. Ceramic plates and printed circuit boards pcb to assess solder wetting. The cookies we use can be categorized as follows.

Also utilized was a 256 leaded and a 256 plastic bga package for evaluating and directly comparing manufacturing robustness and reliability. Incoming pcb requirements for cbga freescale semiconductor. In addition the utilized ceramic ball grid array cbga. Type 2 ceramic and plastic bga packages with nearly 600 i os.

Flip chip hitce ltcc bga package kyocera provides both ceramic and organic packages for large scale integration lsi devices. In addition to alumina al 2 o 3 ceramics we produce aluminum nitride aln with high thermal conductivity 150w mk as well as low temperature co fired ceramic ltcc packages with high 12 3ppm k and low 3. Type 1 ceramic and plastic bga packages with nearly 300 i os. Balls for this package are 90 pb and 10 sn and attached to the ceramic substrate using eutectic 63sn 37pb solder paste.

Ceramic ball grid array packaging assembly reliability freescale semiconductor. Plastic bga pbga ceramic bga cbga pwb 63sn 37pb eutectic flip chip flip chip bga fcbga column cbga ccga 90pb 10sn high melt i o 600 i o 600. Large number of vias within area of bga increases cte locally. Madsen abstract the white paper component reliability after long term storage texas instruments application.