Ceramic Cavity Package

The traditional package for rf power transistors is the air cavity package with a ceramic lid.

Ceramic cavity package.

If saving time and reducing cost is important for your ceramic air cavity packages talk to one of our experts about the fully assembled ca pack package solution. Hermetic or vacuum sealing is typically applied to ensure device quality. Cupack packages unique design with very low thermal resistance. Kyocera provides miniaturized surface mount ceramic packages with cavity structures available on both top and bottom.

Air cavity type hermetic package close thermal expansion matching provides superior mechanical elasticity and less mechanical stress with silicon mems chips miniaturized high density surface mountable package incorporating multi layer ceramic technology. Packages are available in surface mount designs as well as bolt down versions in dozens of open tooled designs. Available in larger sizes up to a cavity of 16 5 mm x 6 1 mm ni780 header unmetallized frames enable shorter lead times and reduce manufacturing complexity. Ca pack packages convenient pre assembled ceramic package.

Ceramic air cavity packages proven performance for wireless applications.