Low profile multilayer ceramic package.
Ceramic chip carrier.
Castellations instead external leads.
Clcc ceramic leadless chip carrier mm inch unit.
The external lead frame is formed into a j shape to allow for socketing or direct board soldering.
Variety of body sizes.
Plastic magazine family coinstack co 021.
Leadless smt packages and chip carriers design concept is based on creating an interconnect pattern on a ceramic substrate with pctf plated copper on thick film technology for multiple or.
Leadless ceramic smt packages and chip carriers with pctf for a direct pcb mount.
Tapepak plug family coinstack magazine.
Leadless ceramic chip carrier legacy hittite package drawing e ey filter packages by entering lead count or product description into the search box below.
1st 2nd 3rd total seal ring die attach a x b c x d e x.
12 lead lcc 2 9mm x 2 9mm w ep e 12 4 pdf.
Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as jedec.
Package outline material information.
Carrier outlines co family registration no.
I updated 10 05 ceramic chip carrier magazine type a b and d 68 pin leadless co 006.
Ceramic leadless chip carrier lcc jedec type leadless chip carriers continue their popularity for surface mount applications.
Socket or surface mount package.
Ceramic chip carrier.
Footprint compatible with cqjb and plcc.
Other forms are proprietary.
Ceramic chip carrier cerquad family 68 lead ceramic leaded cl chip carrier with window square cerquad.
Plastic magazine plug family co 022.
Tapepak magazine family metal coinstack co 019.
Fully hermetic smt package.
Mm lead count pkg type or category cavity overall layer thickness ntk material code b black w white connection 0 non conect drawing no.
Ceramic leaded chip carrier cqfj the ceramic quad flat pack continues to be popular in various surface mount applications.
Chip carriers may be made of ceramic or plastic.
18 small outline transistor family.
17 84 lead ceramic leaded cl chip carrier with window square cerquad.
Commercial quasi hermetic smt package.
In high heat dissipation applications this proves to be an ideal package.
Ceramic leadless chip carrier lcc national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications.
Solder glass or epoxy seal.
Chip carriers can be smaller than dual in line packages and since they use all four edges of the package they can have a larger pin count.