Ceramic Leadless Chip Carrier Socket

Solder glass or epoxy seal.

Ceramic leadless chip carrier socket.

Variety of body sizes. 28 44 52 68 84 and 124. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic. Castellations instead external leads.

Kyocera s multilayer division utilizes the most state of the art equipment combined with a knowledgeable technical staff to create high quality durable leadless chip carriers lcc. Surface mount and soldertail options are available. A premolded plcc was originally released in 1976 but did not see much market adoption. Footprint compatible with cqjb and plcc.

A socket for a leadless chip carrier said socket including a base member having a central opening therein a plurality of conductive resilient contacts for engaging conductive pads on said carrier each contact anchored in said base member and including an upwardly extending part said contacts positioned on at least two side edges of said base member opening and constituting opposing. Low profile multilayer ceramic package. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic. Leadless chip carrier sockets conform to jedec standards a b c and d.

Stainless steel spring latch is available in a variety of thicknesses to facilitate proper contact. Contact is primarily made on the sides of the package not the bottom in order to take advantage of the wiping action. Leadless chip carrier sockets conform to jedec standards a b c and d. The chip is held into the socket by friction.

28 44 52 68 84 and 124. The lcc package is preferred where requirements call out for a low profile package or a surface mountable solderable package with low inductance to be used in. Stainless steel spring latch is available in a variety of thicknesses to facilitate proper contact force with the socket. Surface mount and soldertail options are available.

Gold or solder dip. A plastic leaded chip carrier plcc has a rectangular plastic housing it is a reduced cost evolution of the ceramic leadless chip carrier clcc. A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package. Heat sinks also available in six sizes.

Heat sinks also available in six sizes. Leadless chip carrier sockets. Socket or surface mount package. A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package.